Frt, one of the world’s leading suppliers of 3D metrology for research and development (R&D) and high-volume manufacturing, will present the MicroProf 200 stand-alone metrology platform, this month.

The innovative solution will be showcased at the Control exhibition, the international trade fair for quality assurance, from May 7 to 10 in Stuttgart, Germany.

This third generation system of the MicroProf tool series offers an ultra-stable platform: the completely in-house control and analysis software and more than 20 years of expertise in surface metrology form the basis. FRT’s multi-sensor concept, combined with hybrid measurement technology, supports production lines all over the world, said a company statement.

The MicroProf enables a wide range of measurement tasks to be performed quickly, efficiently and intuitively and is an established standard measuring instrument in modern 3D surface metrology in the semiconductor, medical and automotive industries. They are also used in the sapphire, photovoltaics, mechanical engineering, optics and packaging technology industries.

The devices are very versatile allowing users to measure the topography, the total thickness or the layer thickness of samples without contact. The versatile MicroProf can be used universally due to the proven optical multi-sensor technology. Various optical measuring methods have been combined to form one universal tool providing high-resolution detailed measurements down to the sub-nanometer range. The open combinability of the sensors creates special flexibility. If required, sensors can be retrofitted quickly and easily.

The FRT MicroProf is well established in semiconductor front end, advanced packaging, MEMS, VCSEL, automotive, engineering and optics.

A third generation ultra stable platform and complete in-house software are the result of more than 20 years of experience. The FRT multi-sensor concept and hybrid metrology options are empowering production lines around the world. The applications are topography, step height, roughness, TTV, bow, warp, stress, TSV, layer and stack thickness, overlay and CD – and many other parameters, contact-free and fully automated. Various measuring methods can be combined with point, line and field of view sensors and as well as film thickness sensors and atomic force microscope in one metrology tool and within one recipe.