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New thermoset line up and running

The latest addition to Sabic’s specialty additives and intermediates helps boost performance while exercising sustainability and exceptional cost control

October 2012

Sabic’s Innovative Plastics business launched a new breakthrough line of Noryl SA90 and SA9000 resins that can be used as additives for epoxy and non-epoxy thermoset systems.

These advanced new materials address expanding requirements and regulations for printed circuit boards (PCBs), including the call for enhanced sustainability and exceptional overall cost control. Noryl SA90 and SA9000 resins can also be used by makers of pre-pregs and copper-coated laminates, electrical adhesives, composites and coatings – to significantly boost the performance and sustainability of their existing thermoset products without upgrading to more expensive materials.

Sabic’s scientists modified the chemistry of the company’s renowned high molecular weight Noryl PPO polyphenylene ether resin to create low molecular weight, bi-functional oligomers that deliver an improved balance of low dielectric constant and loss factor, increased toughness and higher thermal reliability. The material also provides substantially better moisture stability, more consistent dielectrics, and reduced loading of non-halogenated flame retardants (FR) vs competitive products.

Noryl SA90 resin, designed as an additive for epoxy and cyanate ester-based thermosets, provides lower dielectric constant and loss factor to enable better high-frequency performance (1-10 gigahertz (GHz)) in epoxy-based PCBs to help customers meet the demand for higher operating frequencies and non-halogenated FR systems. Noryl SA90 resin is soluble (at loadings of up to 50 per cent) in methyl ethyl ketone (MEK) at room temperature, thus avoiding the use of extreme solvents commonly needed for traditional polyphenylene ether (PPE) resins that can pose difficulties in safe handling in the electrical laminate market.

Similarly, Noryl SA9000 resin provides lower dielectric constant and loss for improved high-frequency performance (up to 20 GHz) in non-epoxy based thermoset systems. It allows manufacturers to provide non-halogenated FR in free radical cure (vinyl or triallylisocyanurate (Taic)) PCBs.

Both Noryl resins provide lower moisture uptake for more-stable dielectrics and higher glass transition temperatures.




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